Qualification: Prefer Mechanical degree with 5 yrs related working experience Roles and Job responsibility - In charge of FC Ball Attached, Ball Scan and Final Optical inspec…
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
Requirements: 1. Graduate with Bachelor Degree in Mechanical Engineering field. 2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a pl…
Packaging Mechanical Simulation Engineer Kuala Lumpur, Malaysia The future starts here! Are you ready to join NXP in Package Innovation? The Package Innovation organization is…
Packaging Materials Engineer Kuala Lumpur, Malaysia The future starts here! Ready to join NXP in the Package Innovation department The Package Innovation organization is respo…
The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging produ…
Drive improvement to meet committed KPI through deep dive analysis and innovative ideas and solutions. Build good collaboration with all stake holder (Hardware, PM, Manufacturing,…