BE BGA Assembly Process Engineer
NXP Semiconductors
- Kuala Lumpur
- Permanent
- Full-time
1. Analysis of rejects from vision inspection system.
2. To raise MDR (Material Disposition Review) for non-conformance products and raise (CAB) Change Action Board
for new machine or product or material qualification.
3. Perform necessary assessment, evaluation and documentation in change management.
4. Provide lot disposition timely.
5. Perform Measurement System Analysis that includes Gage Repeatability and Reproducibility
6. Liase with machine supplier on issues pertaining to machine.
7. He/She is also a focus point between downstream processes and extended factory.
8. Drive yield improvements in BGA BE and support any NPI (New Product Innovation) qualification.
9. Able to plot and perform analysis using SPC (Staticial Process Chart) product outcome.
10. Apply DMIAC approach or (FMEA) Failure Mode Effect Analysis tool to resolve the daily production issues.*Note: Not limited to the above job descriptionRequirements:
1. Graduate with Bachelor Degree in Mechanical / Material Engineering field.
2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a plus, especially in BGA Assembly - Ball Attach / Reflow / Molding Process)
3. Proficient in Bahasa Malaysia & English (Both Read/Write)
4. Has experience in Microsoft (Excel, Powerpoint, Word & etc)
5. Has good problem solving and analytical thinking skills.
6. Able to work under pressure and tight schedule.