Semiconductor Packaging Engineer

• The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies.
• Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings. Then, effectively develops or designs the implementation of these into manufacturing.
• Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences.
• May also participate in development of patent applications.
• Maintains an understanding of the semiconductor market and effectively translates market requirements to packaging.

• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
• Bachelors or Masters in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
• Team player with positive attitude, self-driven with excellent written and oral communication skills.

NXP Semiconductors