Packaging Materials Engineer Kuala Lumpur, Malaysia The future starts here! Ready to join NXP in the Package Innovation department The Package Innovation organization is respo…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
Requirements: 1. Graduate with Bachelor Degree in Mechanical Engineering field. 2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a pl…
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