The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging produ…
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
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