Business Unit Description: NXP's Technology organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive tec…
The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging produ…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the…
Job Description: Provide Reliability Assessment support for cutting edge products. Drive and Enhance Reliability monitoring and reporting for current products. Coordinate and …
JOB DESCRIPTION Interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism…
The Failure Analysis Enablement Team is seeking a candidate to assist with generating the software tools needed to support failure analysis of NXP products. This candidate will int…
Job Description: Coordinate and support Qualification for New Product, New Package, and New Wafer Fabrication Technology. Ensure that new product releases meet manufacturabilit…
Provide support engineering support for Reliability analysis includes but not limited to: 1. Bias Stressing (Burn-in, THB, Hast) 2. ESD Stressing (MM, HBM, CDM) 3. Environmental…
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