Business Unit Description: NXP's Technology organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive tec…
The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging produ…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the…
Job Description: Coordinate and support Qualification for New Product, New Package, and New Wafer Fabrication Technology. Ensure that new product releases meet manufacturabilit…
The Failure Analysis Enablement Team is seeking a candidate to assist with generating the software tools needed to support failure analysis of NXP products. This candidate will int…
JOB DESCRIPTION Interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism…
Job Description: Provide Reliability Assessment support for cutting edge products. Drive and Enhance Reliability monitoring and reporting for current products. Coordinate and …
Get email alerts for the latest Jobs in Kuala Lumpur