Req ID: 128498 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Job Title: Lead Engineer, Test Manufacturing Function…
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Job Title: Engineer, Test Manufacturing Functional Area: Engineering …
Req ID: 127953 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Job Title: Lead Engineer, Test Manufacturing Function…
General Overview Job Title: Lead Engineer, Test Manufacturing Functional Area: Engineering (ENG) Career Stream: Test Engineering Manufacturing (TEM) Role: Lead Engineer (LEN) Job C…
Job Details: Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated cir…
Job Details: Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated cir…
Job Summary Responsible for SMT (Surface Mount Technology) printing and placement equipment, process optimization, and technology improvement. Key Responsibilities 1. Process…
Req ID: 128388 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Job Title: Lead Engineer, Test Manufacturing Function…
Job Details: Job Description: Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as p…
General Overview Job Title: Lead Engineer, Test Manufacturing Functional Area: Engineering (ENG) Career Stream: Test Engineering Manufacturing (TEM) Role: Lead Engineer (LEN) Job C…
Job Details Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits…
Job Details Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits…
Develop wafer technology and wafer technology/product features to realize power devices addressing the application needs while meeting performance, cost, and quality targets Dev…
Perform root cause analysis for ICO/FAR related defects, evaluate defect prevention methodologies in relevant unit processes Job Description In your new role you will: Perfor…
. Job Description In your new role you will: Perform root cause analysis for ICO / FAR related defects, evaluate defect prevention methodologies in relevant unit processes B…
We are seeking talented and motivated Test Manufacturing Lead Engineer to join our dynamic and growing organization that enable industry leaders to deliver products that leave posi…
Job Details Job Description: Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part o…