. Job Description In your new role you will: Drive the development of GaN power technologies in collaboration withapplication, product, TCAD simulation and reliability teams.…
Job Details: Job Description: Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. …
Job Details: Job Description: Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as p…
Initiate/lead yield/Inline/PCM/DD and quality improvement programs. Job Description In your new role you will: Initiate/lead yield/Inline/PCM/DD and quality improvement progr…
Develop wafer technology and wafer technology/product features to realize power devices addressing the application needs while meeting performance, cost, and quality targets Dev…
Job Details Job Description: Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part o…
Job Details Job Description: Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The r…
Initiate/lead yield/Inline/PCM/DD and quality improvement programs. Job Description In your new role you will: Initiate/lead yield/Inline/PCM/DD and quality improvement programs. L…
Develop wafer technology and wafer technology/product features to realize power devices addressing the application needs while meeting performance, cost, and quality targets Develo…