JOB DESCRIPTION Position: Equipment Engineer (Wirebond) Location: Selangor Darul Ehsan, Malaysia Nature : Permanent Job Responsibilities: Define and manage machine specifications, including purchase order (PO) controls and buy-off procedures. Set up and qualify new and existing wire bond equipment to meet production and quality standards. Develop and implement machine maintenance specifications and ensure execution of routine and breakdown maintenance. Troubleshoot and resolve equipment-related quality issues promptly. Sustain equipment performance, including MTBA/MTBF, and ensure optimal machine and process setup for existing products. Drive capability improvements, cost reduction, parameter optimization, and technical documentation. Lead technical skill development and training for equipment and production personnel. Plan and support initiatives to enhance process productivity and efficiency. Conduct effective root cause analysis using industry best practices. Manage maverick lots and ensure proper lot disposition. Maintain and control in-process documentation and systems. Deliver machine-related training programs to upskill team members. Communicate effectively with customers on equipment and process-related matters. Support new product introductions and scale-up from low to high volume manufacturing. Coordinate and support internal and external audits. Foster a culture of innovation and continuous improvement. Job Requirements: Bachelor's or Master's degree in Engineering (Electronics, Electrical, Mechanical, Mechatronics, Materials, or Manufacturing Engineering). Minimum 3 years of hands-on experience in semiconductor assembly, specifically in wire bond equipment and processes. Strong technical knowledge of semiconductor manufacturing processes: die sawing, die attach, clip bond, encapsulation, trim & form, marking, testing, and packing. Proficient in wire bond machine maintenance, including routine alarms and breakdown recovery. Experience in transitioning products from low to high volume manufacturing. Familiarity with Power devices, QFN packages, and Flip Chip assembly is a plus. Solid understanding of ISO and IATF automotive standards. Skilled in quality tools and methodologies: FMEA, DOE, statistical analysis, 8D, 5S, Six Sigma. Strong project management, organizational, and interpersonal skills. Excellent communication skills-able to present technical concepts confidently to teams and executives. Self-motivated, independent, and capable of working with minimal supervision. Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor.