Principal Engineer Development Package Innovation
Infineon
- Melaka
- Permanent
- Full-time
Job ID: HRC0736892Job description
In your new role you will:
- Observe and proactively act on trends in Package Innovation by having a sense of urgency for upcoming innovation and supporting feasibility studies.
- Facilitate and encourage innovation within his/her field of expertise, coach and challenge new ideas, actively balance risks and opportunities, and drive decisions.
- Contribute to Functional Area business value, roadmap/standards definition with industry partners, and development and implementation of strategy within his/her field of expertise.
- Contribute to the IP strategy in his/her field of expertise providing exploitation options, fostering patent creation, and Infineon's reputation through publications and speeches.
- Responsible for technical decision-making for BL/Functional Area and takes responsibility for implementation.
- Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
- Drive innovation and pre-development activities within the package platform.
- Be the main person and technical consultant/coach for all questions and discussions regarding packaging innovation.
- Collaboratively creates and supports innovative ideas in his/her field of expertise › Investigates new ideas, considers alternatives, and drives active risk management.
- Represents technical competence of Package Innovation. Has a measurable impact on BL/Functions business value and strategy Implementation.
You are best equipped for this task if you have:
- Bachelor's Degree in Engineering in Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, and Electronics Physics.
- At least 9 years of relevant working experience in an IC/semiconductor environment.
- Background in Semiconductor Packaging, Assembly and Test.
- Process and Equipment Engineering knowledge.
- Semiconductors Products application knowledge.
- Analytical and Problem-Solving skills.
- AutoCAD and 3D drafting preferred.
- Material science knowleges.
- Package requirement and qualification knowledges
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Does this sound like just the right challenge for you? If so, we look forward to getting to know you!(It only takes 90 seconds)