Job Description In your new role you will: Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation. Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes/new package, risks and impact. Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements Be the cContact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Support pre development & project definition stage, and continue to be package design expert throughout project phase. Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons. Be the main contact person and technical consultant/coach for all questions and discussion regarding packaging, package design and Package. Drive innovation and pre development activities within the package platform. Your Profile You are best equipped for this task if you have: Bachelor's Degree in Engineering or Physics. At least 5 years of working experience in IC/semiconductor environment. Excellent technical knowledge of BE processes and materials in plasticpackages and interaction to the different functions (interaction of BOM,package construction, design rules and process). Good understanding of Automotive quality requirements and standards. Strong analytical skills, ability to deal with conflict and ambiguity. Strong communication and stakeholder management skills across alllevels. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.
