Business Unit Description: NXP's Technology organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive tec…
Packaging Materials Engineer Kuala Lumpur, Malaysia The future starts here! Ready to join NXP in the Package Innovation department The Package Innovation organization is respo…
Drive improvement to meet committed KPI through good collaboration with all stake holder (Hardware, PM, Manufacturing & engineering). Train and supervise team of technicians to im…
Responsible on wire bond AOI Process at Front-end assembly. To maintain the wire bond AOI performance through various leading indicators (WB AOI yield, MDR, Assist) Work with the…
Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. Responsible for quality, yield, cost and process improvement…
Scope of Responsibilities: This is a senior Process Engineering position within ATKL Wafer Test department. Working on NPI/NPT of highly integrated, multi core processors and cont…
Drive improvement to meet committed KPI through deep dive analysis and innovative ideas and solutions. Build good collaboration with all stake holder (Hardware, PM, Manufacturing,…
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