Job Responsibilities: Backend IC packaging turnkey solutions provider that include wafer bumping, wafer sort, assembly and testing. Expanded machine failure investigation and im…
Job Description In your new role you will: Define test concepts and test specifications for Integrated GaN solutions in cooperation with the concept engineering and design team Dev…
Job Description In your new role you will: Define test concepts and test specifications for Integrated GaN solutions in cooperation with the concept engineering and design team Dev…