The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging produ…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
Company Description The future. It's on you. You & Western Digital. We've been storing the world's data for more than 50 years. Once, it was the most important thing we could d…
Company Description The future. It’s on you. You & Western Digital. We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could d…
Company Description The future. It's on you. You & Western Digital. We've been storing the world's data for more than 50 years. Once, it was the most important thing we could d…
Packaging Mechanical Simulation Engineer Kuala Lumpur, Malaysia The future starts here! Are you ready to join NXP in Package Innovation? The Package Innovation organization is…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At ou…
Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto-pilot processes Sustains and continuously improves qualified technologies in vol…
Malaysia Job details Posted 15 April 2024 SalaryNegotiable LocationPerak Job type Discipline Reference272046_1713191494 General Manager Job description Our client is a rapi…
Location: Melaka Job ID: HRC0752317 Job description In your new role you will: Wire Bond expert, responsible to achieve robust and auto-pilot processes Sustains and continu…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
The company: We are an innovative functional materials and innovative device leader with a company size of 400. We are focused on integrated research and development, manufacturin…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
Location: Melaka Job ID: HRC0736892 Job description In your new role you will: Observe and proactively act on trends in Package Innovation by having a sense of urgency for u…
Role Summary: leading and managing activities of Assembly Process, working together with various groups (particularly Manufacturing, Equipment, Quality and Packaging Innovation) …
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. A…
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and …
Job Position – PROCESS ENGINEER ( PASIR GUDANG ) Job Descriptions 1) Option 1: DCB Sintering Monitor process status, assess the impact of changes in process parameters on prod…