Principal Engineer Failure Analysis

• Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and physical root cause analysis.

• Lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings such as Task Force & Focus Team.

• FA equipment / tool ownership.

• Interface with designers, test, product, process integration and unit process engineers to understand the analysis requirement.

• Identify development opportunity of new EFA techniques and improvise FA skills and techniques to enhance analysis quality, speed and cost.

• Responsible for FA readiness on new Transfer of Technology for FAB support or Products Line & Groups for FAR.

• Responsible for EFA development roadmap.

• Execution and understanding of IFX and IFKM business process.

• Qualification: Degree / Master / Ph D in Electrical and Electronic Engineering.

• Job experience: 8+ years working experience in Semiconductor FA field.

• Technical Knowledge: Advanced Electrical Failure Verification and Localization, i.e. Scan logic , Hi Level Tester, SDL analysis, Emission microscopy, TIVA, OBIRCH Technique, IR-Lock In thermography, Time Domain Reflectometry.

• Sample preparation, i.e. mechanical polishing, precision cleaving, wet/dry chemical, backside preparation, package preparation.

• Imaging, i.e. optical, SEM and FIB (incl. Voltage Contrast analysis).

• Repackaging skill i.e. Wire bonding and rework & repackaging method.

• CAD Navigation plus Cross Mapping Schematic.

• Software Diagnosis on Logic FA.

• Circuit troubleshooting via micro probing (A-pad, FIB pad or AFP).

• Semiconductor processing, fabrication and testing.

• ATE result interpretation.

Infineon