Process Lead Engineer (Diebond)

Michael Page

Muar, Johor
RM 84,000-120,000 per year
Permanent
Full-time

2 months ago
Apply easily

Seeking for a specialist in Diebond process

Lead a group of process (Die bond, Panel release and transfer, Sputtering, DLC, Carrier plate preparation)
Monitor, analyze and drive yield performance. Work out with process owner on yield improvement
Manage carrier plate preparation process to ensure the carrier plate quality and circulation management well done.
Work as a team between Operation/ Equipment/ Quality to resolve production, quality issue and reduce production line disruption.
Perform FMEA, risk assessment of process changes with proper change management process.

Growing and Expanding organisation|Challenges that comes with rewarding benefit

Masters / Bachelor's Degree in Engineering (Mechanical / Mechatronics / Manufacturing/ Material Science / Chemical) or equivalent.
Minimum 5-10 years working experiences (specialist in die bond preferrable)
Good communication skill and equipped with strong analytical skills.
Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.
Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
Able to lead and coach engineer and tech.

My client is an European MNC Semicondcutor Manufacturer based in the Southern Region. They have a matured manufacturing facilities with capabilities covering both Front-of-line & End-of-line. As they progress in expanding their capabilities in Malaysia, they are seeking for talented engineers to support in this growth.

Great opportunity to work with one of the renowned semiconductor players in the market
Be part of an expanding organisation

Michael Page