Senior Engineer, Packaging Engineering
Western Digital
- Perai, Pulau Pinang
- Permanent
- Full-time
- Provide mechanical simulations and solutions for advanced 3D NAND products
- Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities
- Design and conduct fundamental level experiments for structural and material characterizations
- Work in Simulation calibration, validation and automation
- Research, explore and establish simulation capabilities in challenged areas
- Master degree and above, PH.D is preferred. PH.D with 2-3 years working experience, and master should have 3-5 years working experience. (Working experience is not hard required for excellent candidates)
- Education background in mechanical/mechanics/material science, etc, and have a good understanding in solid mechanics, finite element method, material mechanical behaviors
- Should be familiar with semiconductor industry in package structure/materials/assembly/reliability.
- On-hand experience in mechanical simulations is preferred (Solidoworks/ANSYS/ABAQUS).
- At least be skillful in one programing language(python or others)
- Keen insight into the failure mechanism, be able to verify and improve the problems using simulation.
- Good team player, eager to learn and innovate.