Direct Lid/Stiffener Attach Packaging Module Development Engineer

Intel

  • Kulim, Kedah
  • Permanent
  • Full-time
  • 23 days ago
Job Details:Job Description: The position is for Package Module Development Engineer for direct lid/stiffener attach module as part of ATTD (Assembly and Test Technology Development) in Asia initiative. The candidate will define and establish process flow, conduct FMEA assessment, procedures, drawings review and equipment configuration for NPI products. Selects and develops material and equipment (recipe, collaterals based on design rules) and drives improvement for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements over variables such as material, method, equipment, environment and operating personnel. Plans and conduct experiments to fully characterize the process throughout the development cycle. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Candidate will also participate in pathfinding activities including new TIM (thermal interface material) qualification with regards to thermal performance, new failure mode characterization and resolution.Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other virtual factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. A successful candidate should also exhibit the following behavioral traits: Problem-solving, analytical, troubleshooting willingness and communication skills.Qualifications:Minimum Qualifications:
  • Bachelor’s/Master's degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field).
  • Min. 2 years in process development and equipment engineering in semiconductor field.
  • Involvement in research and development in assembly and packaging.
  • Knowledge in statistical design of experiments and problem-solving techniques.
Preferred Qualifications:
  • 4 years+ experience preferred in process development and equipment engineering in semiconductor field.
  • Experience in lid/IHS (integrated heat spreader), stiffener attach and dispensing process.
  • Data science/statistical tools experience (JMP/SQL) and AI/ML knowledge is a plus.
Job Type: Experienced HireShift: Shift 1 (Malaysia)Primary Location: Malaysia, KulimAdditional Locations:Business group:Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust N/AWork Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Intel