Job Description In your new role you will: Responsible for Thermomechanical Simulation of BE Assembly Processes (e.g., Die Bond, Wire Bond, Transfer Molding, Lead Cutting & Forming, etc.) using FEA, CFD or other numerical techniques Performing simulation-based risk assessment of manufacturability issues (e.g., warpage) and reliability issues (e.g., delamination, crack, cyclic fatigue, etc.) Your Profile You are best equipped for this task if you have: Masters/Bachelor&aposs Degree in Engineering or relevant course 8+ years working experience in semiconductor manufacturing industry Advanced Level in Finite Element Analysis (minimum requirement) Familiarity with assembly processes involved in Electronic Packaging Familiarity with material characterization techniques will be a definite advantage Adaptability to adjust to dynamic changes in customer requirements Creativity in finding new ways to solve technical problems Possess good interpersonal skills Ability to communicate complex technical solutions in a way that clients clearly understand #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Show more Show less