
ENGR PRIN, PACKAGE DEVELOPMENT
- Seremban, Negeri Sembilan
- Permanent
- Full-time
- This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and process for early engagement in package development and qualification for a robust HVM.
- Analyze and implement efficient, cost effective and innovative methodologies to improve assembly processes.
- Good knowledge in Six Sigma methodology and the DMAIC approach.
- Experienced in running the Design of Experiment (DOE) and analyzing data using JMP software.
- Practice good quality system and production control.
- Good teamwork and leadership.
- Must be statistically sound and familiar in running DOE, perform characterization and optimization studies independently. Familiar with JMP/ minitab software is an advantage.
- Proficient in Malay and English.
- Minimum Bachelor's Degree in Electronic, Electrical, Mechanical, material Engineering or equivalent.
- Minimum of 7 years work experience as a mold/ trim and form engineer preferred.