Role Description This is a full-time on-site role for an Engineer - Jigsaw & BGA based in Penang, Malaysia. The Engineer will be responsible for operating and maintaining jigsaw and Ball Grid Array (BGA) assembly equipment, troubleshooting technical issues, ensuring compliance with quality standards, and collaborating with cross-functional teams to optimize manufacturing processes. Key Responsibilities : Lead the process control and maintain appropriate documentation. Sustain Machine performance in term of Down Time, MTBA, MTBF and Throughput. Lead continue improvement project related to machine performance or cost saving. Manage resources in term of shift coverage, discipline and training. Support on audit (internal, external and customer) Manage documentation related to equipment (edit or create documentation of Procedure, Machine OCAP, Machine FMEA, Check list & etc) Defining Product Requirements: Working with system architects and product teams to establish specifications for BGA components. Process Engineering- Develop and optimize BGA assembly processes (wire bond or flip chip, underfill, ball attach, reflow, cleaning). Process Engineering- Ensure robust BGA solder ball formation and reflow profiles and troubleshoot BGA-related assembly issues like voids, open/short balls, delamination, etc. Process Engineering- Lead process excursions and implement corrective/preventive actions Yield Improvement & Failure Analysis- Perform root cause analysis on assembly/packaging failures (e.g., solder cracks, head-in-pillow). Lead FA discussion with FA engineer for FA activities like X-ray, CSAM, SAT, Cross-sectioning, and SEM/EDX. Yield Improvement & Failure Analysis- working with customer to establish the rework process for certain defect. Manufacturing & Sustaining Support-Establish manufacturing process controls (SOPs, FMEAs, SPC), Monitor and maintain process KPIs (yield, defect rate, cycle time). Manufacturing & Sustaining Support- Lead process excursions and implement corrective/preventive actions Cross-functional Collaboration- Work closely with vendors, quality teams and Interface with customer on BGA packaging inquiries or issues Cross-functional Collaboration- Support new product introduction (NPI) and design for manufacturability (DFM). Knowledge of ISO 9001, ISO 14001, ISO 13485, IATF 16949 standards is a plus Qualifications Experience with Jigsaw and BGA assembly operations Technical skills in troubleshooting and maintaining assembly equipment Knowledge of quality standards and compliance measures Ability to collaborate with cross-functional teams to optimize processes Strong problem-solving skills and attention to detail Excellent written and verbal communication skills Bachelor&aposs degree in Engineering or a related field Experience in the electronics manufacturing industry is a plus Strong proficiency in Mandarin speaking (Chinese Literate) - To deal with Taiwanese customer. Full Time position base in Bayan Lepas, Penang, Malaysia. Show more Show less