Mold Process Development( NPI) Engineer
Western Digital
- Batu Kawan, Pulau Pinang
- Permanent
- Full-time
- Responsible for Mold Process Recipe/Process Parameters setup
- Define the process window and recipe baseline by using JMP DOE approach.
- Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology
- Work closely with Cross site’s Package development team to understand the Package Design Rules & Requirements
- Ensure smooth transition from Development to new product qualification phase
- Work closely with manufacturing process and equipment team, and cross site process development team
- Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
- Ensure effective hand shake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
- Responsible for new material/component first article inspection and final buyoff.
- Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
- Ensure robustness of process control to meet yield & through-put expectation.
- Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.
- Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, Physics & etc)
- Hands on personality – production line focus personnel
- Good project planning, strong sense of quality and urgency
- Team player with good communication and interpersonal skills