Assembly Backend Process Engineering

NXP Semiconductors

  • Kuala Lumpur
  • Permanent
  • Full-time
  • 11 days ago
1. He/She role will be as Process engineer at BE BGA Assembly Process Engineering Group which will supporting processes such as Package Saw and Punch Singulation.
2. To raise MDR (Material Disposition Review) for non-conformance products.
3. Perform necessary assessment, evaluation and documentation in change management.
4. Provide lot disposition timely.
5. Perform Measurement System Analysis that includes Gage Repeatability and Reproducibility.
6. Liase with machine supplier on issues pertaining to machine.
7. Drive yield improvements in BGA BE.Requirements:
1. Graduate with bachelor's degree in mechanical engineering field.
2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a plus, especially in BGA)
3. Proficient in Bahasa Malaysia & English (Both Read/Write)
4. Has experience in Microsoft (Excel, Powerpoint, Word & etc)
5. Has good problem solving and analytical thinking skills.
6. Able to work under pressure and tight schedule.#LI-633a

NXP Semiconductors