SSD Technical Program Manager, Packaging Engineering
Western Digital
- Batu Kawan, Pulau Pinang
- Permanent
- Full-time
- Master’s degree or Above in Material Science, Polymer Science, Mechanical Engineering, or other engineering disciplines.
- Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
- Self-motivated and self-directed.
- Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
- Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
- Excellent communication skills, enabling collaboration with global functional teams.