Engineer / Senior Flip Chip Die Attach / Underfill Process Development Engineer
Western Digital
- Batu Kawan, Pulau Pinang
- Permanent
- Full-time
- Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development.
- Supports New Product Introduction by delivering assigned Process and Equipment solutions meeting quality, development, and operation targets and requirements.
- New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications.
- Define Leading edge Flip Chip Die Attach & Underfill Technology Roadmap / building block.
- Setup new Flip Chip Die Attach & Underfill processes, recipe, perform complete window study, DOEs, corner limits.
- Golden recipe setup for new package qualification.
- Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
- To introduce new products and devices to the production line and to build new process technology capabilities, make sure that the handshake and process handover are done effectively.
- Support new material and tools qualification.
- Work closely with Cross site’s Package development & design team to understand the Package Design Rules & Requirements.
- Strong problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
- Responsible and accountable to related tasks as assigned by superior.
- Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, Physics & etc).
- Min 3-5 years of experience in Flip Chip / Underfill / Die Attach process development preferred.
- Hands on personality – production line and quality focus personnel.
- Knowledge in Semiconductor assembly processes is a plus point.
- Knowledge in Datacon Flip Chip bonder is a plus point.
- Knowledge in Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Design Of Experiment (DOE), Minitab, JMP is an added advantage.
- Self- motivated, possess initiatives and ability to lead and work independently.
- Good project planning, strong sense of quality and urgency.
- Team player with good communication and interpersonal skills.